Lead-containing solder bumps

ABSTRACT

The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.

RELATED PATENT DATA

This application is related to U.S. Provisional Application Ser. No.60/417,241, which was filed on Oct. 8, 2002.

TECHNICAL FIELD

The invention pertains to semiconductor packages; lead-containingsolders and anodes; and methods of removing alpha-emitters frommaterials.

BACKGROUND OF THE INVENTION

Solders are commonly utilized in semiconductor device packaging. If thesolders contain alpha particle emitting isotopes (referred to herein asalpha particle emitters), emitted alpha particles can cause damage topackaged semiconductor devices. Accordingly, it is desired to reduce theconcentration of alpha particle emitters within the solders.

An exemplary prior art semiconductor package is shown in FIG. 1 as apackage 50, with the exemplary package representing a flip-chipconstruction. The package comprises a semiconductor component 12 (suchas, for example, an integrated circuit chip). The package also comprisesa board 14 utilized to support the semiconductor component 12. Aplurality of contact pads 38 (only some of which are labeled) are joinedto chip 12, and a plurality of contact pads 40 (only some of which arelabeled) are joined to board 14. Solder balls or bumps 39 (only some ofwhich are labeled) are provided between pads 38 and 40 to formelectrical interconnects between pads 38 and 40. The electricalconnection utilizing the solder balls or bumps 39 with pads 38 and 40can incorporate so-called wafer bump technology.

Suitable encapsulant 44 can be provided over the chip 12 and substrate14 as shown. Additionally, and/or alternatively, thermal transferdevices (not shown) such as heat sinks and heat spreaders can beprovided over the chip 12.

Contact pads 30 (only some of which are labeled) are on an underside ofthe board 14 (i.e., on a side of board 14 in opposing relation relativeto the side proximate chip 12). Contact pads 30 typically comprisestacks of copper, nickel and gold. Solder balls 32 (only some of whichare labeled) are provided on the contact pads and utilized to formelectrical interconnections between the contact pads 30 and othercircuitry (not shown) external of the chip package. The contact pads 40can be connected with pads 30 through circuit traces (not shown)extending through board 14.

The shown package 50 has solder proximate chip 12 from at least balls39, and possibly through wafer bumps associated with pads 38 and/or pads40. There can be other applications of solder within package 50 whichare not specifically shown. For instance, a solder paste can be providedbetween chip 12 and various thermal transfer devices.

The solders utilized in package 50 can be problematic, as discussedabove, in that the solders can contain alpha particle emitters. Alphaparticles are problematic for semiconductor devices because the alphaparticles can induce so-called soft errors. The errors are referred tobeing “soft” in that the errors are not permanent. However, the errorswill typically cause at least one round of incorrect calculations.

There are numerous sources for alpha particles, including reactionscaused by cosmic rays. However, the source which is frequently mostproblematic for semiconductor device packages is solder utilized forforming various interconnections relative to semiconductor dies. Forinstance, the wafer-bump technique is becoming relatively common forforming high density interconnects to semiconductor dies. The bumps areportions of solder formed over electrical nodes associated with asemiconductor die package. If the solder utilized in the bumps has alphaparticle emitting components, the alpha particles are frequently emittedclose to integrated circuitry associated with the semiconductor die.

Occasionally, the solder formed over the electrical nodes is in the formof large pillars. Such pillars are frequently referred to as columns.For purposes of interpreting this disclosure, the term “bump” is to beunderstood to encompass various forms of solder formed over electricalnodes, including the forms commonly referred to as columns.

A typical component of many solders is lead. However, one of the leadisotopes (specifically ²¹⁰Pb) has a decay chain that leads to alphaparticles. Further, various common contaminants of lead can emit alphaparticles, including, for example, isotopes of uranium, thorium, radiumand polonium.

The alpha particle emitters present in lead can be present in the orefrom which the lead is initially refined. Alpha particle emitters can bealternatively, or additionally, introduced during processing and/or useof the lead. For instance, phosphoric acid and some antistatic systemscontain alpha particle emitters; some abrasives and cleaning agents canintroduce alpha particle emitters into lead; and smelting of commerciallead can introduce uranium, thorium and other alpha particle emittersinto the lead from gangue rock.

The amount of alpha particle emitters present in lead is typicallydetermined by an alpha flux measurement, with results stated in terms ofalpha particle counts per unit area per hour (cts/cm²/hr). It ispossible to commercially obtain lead having an alpha flux of from 0.002to 0.02 cts/cm²/hr, but it is very difficult to obtain a material with alower alpha flux. However, the semiconductor industry is requestingmaterials with significantly lower alpha flux, including for example,materials having an alpha flux of less than 0.0001 cts/cm²/hr.

Among the difficulties associated with reducing the concentration ofalpha flux emitters in a material to extremely low levels is adifficulty in measuring the concentration of the emitters at flux levelsbelow 0.002 cts/cm²/hr. Unless the concentration can be measured, it isdifficult to monitor a purification process to determine if alphaparticle emitters are being removed. For instance, it can be difficultto determine at any given stage of the purification process if alphaparticle emitters are fractionating with a material or away from thematerial.

Although the discussion above focuses on removing alpha particleemitters from lead-containing solders, it should be understood thatalpha particle emitters are also problematic in other materials. Forinstance, one of the methods utilized to reduce the concentration ofalpha particle emitters in solder has been to create so-called lead-freesolders. Such solders contain little, if any, lead, which is desirablefrom an environmental perspective. However, the solders can still havean undesirable amount of alpha particle emitters present therein.Exemplary lead free solders are Sn: 3.5% Ag; Sn: 4% Ag: 0.5% Cu; and Bi:2-13% Ag, where the percentages are by weight.

One of the methods which has been utilized for reducing the number ofalpha particle emitters in lead-containing solders is to start with leadmaterials which have very few emitters therein. Presently there arethree sources of such materials. The sources are (1) very old lead wherethe ²¹⁰Pb has substantially all decayed; (2) some specific PbS orebodies which have very little ²¹⁰Pb therein, and which have beencarefully refined; and (3) lead which has been subjected to laserisotope separation to remove the ²¹⁰Pb from the lead. Various problemsexist with all of the sources. For instance, the first source utilizesvery old Pb, and such is often poorly refined and therefore containsvarious radionuclides as contaminants. The second source typically doesnot have a low enough alpha particle emitter concentration to meet theultimately desired requirements of the semiconductor industry. The thirdsource is very energy intensive to form, and therefore is notcommercially feasible.

SUMMARY OF THE INVENTION

In one aspect, the invention includes a method of refining a material.An initial composition of the material is provided. The initialcomposition has an alpha flux of greater than or equal to 0.002cts/cm²/hr. The material is purified to form a second composition of thematerial. The second composition has an alpha flux of less than 0.001cts/cm²/hr, preferably less than 0.0005 cts/cm²/hr, more preferably lessthan 0.0002 cts/cm²/hr, and even more preferably less than 0.0001cts/cm²/hr. The purification can comprise, for example, electro-refiningand/or chemical refining.

In yet another aspect, the invention includes a semiconductor structurecomprising a solder having an alpha flux of less than 0.001 cts/cm²/hr,preferably less than 0.0005 cts/cm²/hr, more preferably less than 0.0002cts/cm²/hr, and even more preferably less than 0.0001 cts/cm²/hr.

In yet another aspect, the invention includes a lead-containing anodehaving an alpha flux of less than 0.001 cts/cm²/hr, preferably less than0.0005 cts/cm²/hr, more preferably less than 0.0002 cts/cm²/hr, and evenmore preferably less than 0.0001 cts/cm²/hr.

In yet another aspect, the invention includes a lead-containing solderbump having an alpha flux of less than 0.001 cts/cm²/hr, preferably lessthan 0.0005 cts/cm²/hr, more preferably less than 0.0002 cts/cm²/hr, andeven more preferably less than 0.0001 cts/cm²/hr. The bump can, inparticular aspects, be in the form of a column.

In yet another aspect, the invention includes a lead-containing solderpaste having an alpha flux of less than 0.001 cts/cm²/hr, preferablyless than 0.0005 cts/cm²/hr, more preferably less than 0.0002cts/cm²/hr, and even more preferably less than 0.0001 cts/cm²/hr.

BRIEF DESCRIPTION OF THE DRAWINGS

Preferred embodiments of the invention are described below withreference to the following accompanying drawings.

FIG. 1 is a diagrammatic cross-sectional side view of a prior artsemiconductor package construction.

FIG. 2 is a graph of alpha counts/cm²/hour versus total impurities for amaterial purified in accordance with an aspect of the present invention.

FIG. 3 is a graph of alpha counts/cm²/hour versus copper concentrationfor a material purified in accordance with an aspect of the presentinvention.

FIG. 4 is a graph of alpha counts/cm²/hour versus total impurities for amaterial purified in accordance with an aspect of the present invention.

FIG. 5 is a graph of alpha counts/cm²/hour versus silver concentrationfor a material purified in accordance with an aspect of the presentinvention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

This disclosure of the invention is submitted in furtherance of theconstitutional purposes of the U.S. Patent Laws “to promote the progressof science and useful arts” (Article 1, Section 8).

One aspect of the invention is a recognition that even though a leadisotope (²¹⁰Pb) is the prominent alpha emitter of lead containing highconcentrations of alpha emitters, such is not the case with leadcontaining low or very low concentrations of alpha emitters. Forpurposes of interpreting this disclosure and the claims that follow,lead containing low concentrations of alpha emitters is lead having analpha flux of about 0.02 cts/cm²/hr, and lead containing very lowconcentrations of alpha emitters is lead having an alpha flux of about0.002 cts/cm²/hr.

It appears that uranium isotopes, thorium isotopes, and perhaps othernon-lead isotopes are the primary alpha emitters of lead containing lowor very low concentrations of alpha emitters. This conclusion is basedon the observation that alpha flux versus time for lead containing lowand very low concentrations of alpha particle emitters does not followthe secular equilibrium curve predicted from ²¹⁰Pb decay. Therecognition that the primary alpha emitters of lead are non-leadisotopes leads to improved methods for reducing the alpha emitter levelof lead initially containing low and very low concentrations of alphaparticle emitters. Specifically, the alpha emitter level can be reducedwith purification methods that remove the minor amounts of non-leadcontaminants from the lead. An exemplary method developed in accordancewith aspects of the present invention is electro-refining utilizing abath containing nitric acid:water (with the nitric acid concentrationbeing from about 2% to about 50%, by volume)

The recognition that non-lead impurities are a primary alpha emittersfor lead containing low or very low concentrations of alpha emitters isalso supported by an observation that alpha flux of such lead can scalewith impurity content of the lead.

Although the invention is generally described herein with reference toremoving alpha particle emitting materials from lead, it is to beunderstood that the invention can also be utilized for purifyingmaterials other than lead (for example metals, such as tin, silver,copper, indium, bismuth etc. that are frequently incorporated intolead-free solders). The removal of alpha particles can be particularlybeneficial for metals utilized in semiconductor manufacture; such as,for example, metals incorporated into wafer bump solders.

One aspect of the invention is a method of indirectly tracking a lowconcentration of at least one alpha particle emitter during purificationof an elemental material. The alpha particle emitter is a contaminant,rather than an isotope of the material. In particular aspects thematerial can be lead and the alpha particle emitters are isotopes ofthorium and uranium. One or more contaminants are identified which arepresent in the elemental material at a greater concentration than thealpha particle emitters, and which fractionate similarly to the emittersduring purification. The identified contaminants are preferablysubstances which can be easily tracked during the purification. Thefractionation of the contaminants refers to distribution of thecontaminants between a portion remaining with the elemental materialwhich is to be purified during the purification process, and a portionseparating from the elemental material. Preferably, the fractionationwill be such that substantially entirely all of the contaminantsseparate from the elemental material during the purification process.

The fractionation of the contaminants is tracked during thepurification, and from such tracked fractionation is extrapolated thefractionation of one or more alpha particle emitters. Accordingly, thefractionation of the alpha particle emitter is inferred (i.e.,indirectly determined), rather than being directly measured. Such canavoid problems associated with attempting to measure an alpha flux for amaterial having a very low concentration of alpha particle emitters. Alow or very low concentration of alpha particle emitters generates analpha flux which is typically not significantly different frombackground, and which is accordingly typically very difficult to measurewith a high degree of confidence. Since the alpha particle emitters arecontaminants rather than isotopes of the elemental material beingpurified, the alpha particle emitters will fractionate with othercontaminants if the purification utilizes methodology which veryspecifically fractionates the elemental material from contaminatingsubstances. Exemplary methodology having appropriate specificity iselectro-refining. Chemical refining can also be used, either in additionto or alternatively to the electro-refining.

The elemental material which is to be purified can, as discussed above,be lead, and can initially comprise at least 99.99 weight % lead priorto the purification. Accordingly, the elemental material which is to bepurified can be considered to consist essentially of, or consist of,lead. In other aspects, the elemental material which is to be purifiedcan consist essentially of, or consist of Ag, Sn, Cu, Bi and In. Inspecific aspects, the material which is to be purified can be ultimatelyused in a lead-free solder.

The method of purification can be any suitable method, including, forexample, chemical refining and/or electro-refining. In an exemplarymethod of purifying lead, electro-refining is utilized with a bathcomprising water and one or more of nitric acid, methane sulfonic acid,fluosilicate and fluoborate. In particular aspects of the invention itis found that electro-refining of lead in a bath comprising orconsisting essentially of nitric acid and water (with the nitric acidbeing present to a concentration of from about 2% to about 50%, byvolume) can be particularly effective for reducing the alpha flux oflead that initially contains low or very low concentrations of alphaemitters. Exemplary conditions for the electro-refining of the lead in anitric acid bath include a bath temperature of from about 70° F. (21°C.) to about 100° F. (38° C.), a treatment time of from about severalhours to about several days, and a treatment current density of fromabout 1 A/ft² to about 70 A/ft².

Several graphs are provided with this disclosure (labeled as FIGS. 2-5),and such graphs evidence that the alpha flux of a material can scalewith the total amount of impurities in the material. Accordingly, thefractionation of alpha emitting particles during a purification processcan be extrapolated from the fractionation of other impurities duringthe purification process. Purification of 99.99% pure silver to 99.999%pure silver resulted in a decrease of alpha activity from 0.0162±0.0017cts/cm²/hr to 0.0062±0.0007 cts/cm²/hr. Purification of 99.99% pure tinto 99.999% pure tin resulted in a decrease of alpha activity from0.0066±0.0005 to 0.0007±0.0008. TABLE 1 Trace Element Components ofSilver Concentration Concentration Element (ppm) in 99.99% Ag (ppm) in99.999% Ag Au 7 <0.5 Cu 5 <0.1 Bi 10 <0.1 Fe 0.7 <0.1

TABLE 2 Trace Element Components of Tin Concentration ConcentrationElement (ppm) in 99.99% Sn (ppm) in 99.999% Ag Ag 1 0.1 Cu 1 0.1 Mg 0.30.1 Si 0.3 0.1 Pb 10 <0.2 

As stated above, the methodologies of the present invention can beutilized for purifying materials associated with lead-free solders, aswell as for purifying materials associated with lead-containing solders.The utilization of the methodologies for reducing alpha emitterconcentrations in lead-free solders can have numerous advantages. Forinstance, it is frequently assumed that lead-free solders will havelittle or no alpha emitters therein. Such assumption is a poorassumption, and is based on the mistaken belief that ²¹⁰Pb is theprimary alpha emitter in solders. Ideally there would be no alphaemitters present in a lead-free material, or at least the level of alphaemission would be below the very low threshold discussed above (i.e.,having an alpha flux below about 0.002 cts/cm²/hr). Such is notavailable in lead-free solders conventionally utilized in semiconductorpackaging, but can be achieved in lead-free solders prepared utilizingmethodologies of the present invention. Specifically, methodologies ofthe present invention can substantially remove alpha emitters (such asisotopes of thorium and uranium) from lead-free solder materials. Theremoval of the alpha emitting contaminants can most easily be verifiedby measuring the alpha flux of the sample since they are normallypresent below the detection limits of most analytical methods such asglow discharge mass spectrometry (GDMS). However analytical methods likeGDMS can be used to track the concentration of non alpha emittingimpurities that are present in higher concentration than the alphaemitters and are removed at a similar rate as the alpha emitters duringpurification.

In compliance with the statute, the invention has been described inlanguage more or less specific as to structural and methodical features.It is to be understood, however, that the invention is not limited tothe specific features shown and described, since the means hereindisclosed comprise preferred forms of putting the invention into effect.The invention is, therefore, claimed in any of its forms ormodifications within the proper scope of the appended claimsappropriately interpreted in accordance with the doctrine ofequivalents.

1-13. (canceled)
 14. A lead-containing solder bump having an alpha fluxof less than 0.001 cts/cm²/hr, the lead-containing solder bumpcomprising at least about 50 weight % lead.
 15. The lead-containingsolder bump of claim 14 having an alpha flux of less than 0.0005cts/cm²/hr.
 16. The lead-containing solder bump of claim 14 having analpha flux of less than 0.0002 cts/cm²/hr.
 17. The lead-containingsolder bump of claim 14 having an alpha flux of less than 0.0001cts/cm²/hr. 18-29. (canceled)